YongAn Huang,
Zhouping Yin,
Xiaodong Wan
Modeling and Application of Flexible Electronics Packaging
Gebonden Engels 2019 9789811336263
Verwachte levertijd ongeveer 9 werkdagen
Samenvatting
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Specificaties
ISBN13:9789811336263
Taal:Engels
Bindwijze:gebonden
Uitgever:Springer Nature Singapore
Lezersrecensies
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Inhoudsopgave
Advanced Electronics Packaging.- Interfacial Modeling of Flexible Multilayer Structures.- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy.- Shear-Assisted Peeling.- Single-Needle Peeling.- Multi-Needle Peeling.- Conformal Peeling.- Laser Lift-Off.- Vacuum-Based Picking-up and Placing-on.
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